| Material |
standard board |
FR-4 |
| burn-in board |
High Tg170 , FR406 , FR408 , IS410 |
| prepreg |
Low DK available , 2mil~8mil |
| Layers |
up to 34L |
| Max. Board thickness |
250mil |
| Min. Trace/Space |
Inner layer |
2.5 mil / 3 mil |
| Outer layer |
3 mil / 3 mil |
| Min. Finish Hole size |
Mechanical Drill |
5 mil |
| Laser Drill |
4 mil |
| Aspect Ratio |
12:1 |
| Layer to Layer Registration |
5 mil |
| Heavy Copper |
Inner layer |
12 oz |
| Outer layer |
4 oz |
| Warp Limit |
0.005" per inch |
| Impedance Control |
+/- 10% |
| Surface Finish |
HASL , ENIG , Immersion Silver , OSP , Carbon , Immersion Tin , Selective Gold, etc. |
| Lead-time |
2~6L |
sample : 4 ~ 6 working days |
| production : 9~18 working days |
| 8~12L |
sample : 7 ~ 10 working days |
| production : 16~25 working days |
| 14~20L |
sample : 10 ~ 16 working days |
| production : 25~35 working days |
| Certification awarded |
ISO9002 , ISO14001 , UL registered |
|
|
|
HDI Development
From through to blind via
8L/2 step HDI
BVH: L1-5/L6-8/L1-8
|
PCB / Prototype PCB 
