1. Lead-free process : we can handle lead-free process in house without any question.

2. Ball Grid Array , BGA : under the component package size is being miniaturization demand , our package type can be achieved over 300pin , including BGA、TAB、CSP、FC and so on.

3. No-clean double side SMT : We already have rather experienced on production and management of surface mount technology.



4. No-clean Wave solder process : Our complete production experience can improve the cold-weld, solder splash, solder skips, solder ball, bridging, poor solderiability,etc ,incurred on Wave solder process. This improvement can increase the efficiency of production and simultaneously provide a good yield rate."